MB85R256FPF-G-BNDE1 Overview

In this case, the memory type of the device can be classified as Non-Volatile. It is available in a case with a Tray shape. An embedded 28-SOIC (0.342, 8.69mm Width) case surrounds memory ics. Memory size on the chip is 256Kb 32K x 8. FRAM-format memory is used in this device, which is a mainstream design. With an extended designed operating temperature of -40°C~85°C TA, this device is capable of lots of demanding applications. A voltage of 2.7V~3.6V is possible to be applied to the supply. The recommended mounting type for this device is Surface Mount. A 28-pin package containing this memory device is used to house this device. This device must operate at a minimum temperature of -40°C. A temperature of no more than 85°C centigrade is recommended for the component to be operated, otherwise, damage might be inflicted on the component. It is recommended that this part be supplied with at least 2.7V volts. Its operating voltage shall not exceed 3.6V.

MB85R256FPF-G-BNDE1 Features

Package / Case: 28-SOIC (0.342, 8.69mm Width)
28 Pins

MB85R256FPF-G-BNDE1 Applications

There are a lot of Fujitsu Electronics America, Inc. MB85R256FPF-G-BNDE1 Memory applications.

• mainframes
• networking
• nonvolatile BIOS memory
• networks
• eSRAM
• graphics card
• printers
• embedded logic
• workstations,
• data buffer