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MB88346BPF-G-BND-JNE1

MB88346BPF-G-BND-JNE1

MB88346BPF-G-BND-JNE1

Fujitsu Electronics America, Inc.

DAC

SOT-23

MB88346BPF-G-BND-JNE1 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Package / Case SOIC
Number of Pins 20
Packaging Digi-Reel®
Max Operating Temperature 70°C
Min Operating Temperature -40°C
Interface SPI, Serial
Power Dissipation-Max 250mW
Number of Bits 12
Supply Type Single
Settling Time 4.4 μs
Number of Converters 2
RoHS Status RoHS Compliant
MB88346BPF-G-BND-JNE1 Product Details

MB88346BPF-G-BND-JNE1 Overview


This package is included in the SOIC package and is available for purchase. Using the Digi-Reel® layout, this FPGA model can be contained in a very small amount of space. The device is designed with 20 pins in total. It is possible for this FPGA to perform as per its specifications as long as it is mounted in Surface Mount direction. In this module, 70°C is the maximum operating temperature at which it can operate. Over -40°C, the operating temperature should be higher.

MB88346BPF-G-BND-JNE1 Features


SOIC package
20 pins


MB88346BPF-G-BND-JNE1 Applications


There are a lot of Fujitsu Electronics America, Inc.
MB88346BPF-G-BND-JNE1 Digital to Analog Converters (DAC) applications.


  • Motor Control
  • Data Distribution System
  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:
  • RF signal generators, arbitrary waveform generators

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