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KBPM210G

KBPM210G

KBPM210G

GeneSiC Semiconductor

KBPM210G datasheet pdf and Diodes - Bridge Rectifiers product details from GeneSiC Semiconductor stock available on our website

SOT-23

KBPM210G Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 7 Weeks
Mount Surface Mount
Mounting Type Through Hole
Package / Case 4-SIP, KBPM
Number of Pins 4
Operating Temperature -55°C~150°C TJ
Packaging Bulk
Published 2010
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Pitch 1.25mm
Technology Standard
Orientation Right Angle
Number of Contacts 2
Diode Type Single Phase
Current - Reverse Leakage @ Vr 5μA @ 50V
Voltage - Forward (Vf) (Max) @ If 1.1V @ 2A
Max Voltage Rating (DC) 5.05kV
Forward Current 2A
Max Reverse Leakage Current 5μA
Max Surge Current 65A
Peak Reverse Current 5A
Max Repetitive Reverse Voltage (Vrrm) 1kV
Voltage - Peak Reverse (Max) 1kV
RoHS Status RoHS Compliant
KBPM210G Product Details

KBPM210G Overview


In this device, the forward voltage is 2A.Basically, it is a 4-SIP, KBPM package-type electronic component.Bridge rectifier is important to monBridge rectifieror the reverse leakage current and not allow Bridge rectifier to exceed 5μA.There is no mounting method for the device.Keeping it at -55°C~150°C TJ ensures its normal operation.The surge current should be monitored and should not exceed zero.For powering this device, there is a peak reverse voltage of 5A.

KBPM210G Features


2A forward voltage
forward voltage of 2A
4-SIP, KBPM package
operating at a temperature of -55°C~150°C TJ
peak reverse voltage of 5A
a reverse voltage peak of 5A

KBPM210G Applications


There are a lot of GeneSiC Semiconductor KBPM210G applications of bridge rectifiers.

  • High forward surge current capability
  • Low thermal resistance
  • Rectifier for induction heating
  • Inductive heating – Input rectifiers
  • SCR and diode based input rectifiers
  • SCR power bridges for solid state starters
  • High temperature and rectifiers
  • Welding equipment
  • Electroplating systems – Input SCRs and output rectifiers
  • Fuse-in-glass diodes design

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