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GD25LD40CEIGR

GD25LD40CEIGR

GD25LD40CEIGR

GigaDevice Semiconductor (HK) Limited

Memory IC

SOT-23

GD25LD40CEIGR Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 4 Weeks
Mounting Type Surface Mount
Package / Case 8-XFDFN Exposed Pad
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Technology FLASH - NOR
Voltage - Supply 1.65V~2V
Memory Size 4Mb 512K x 8
Memory Type Non-Volatile
Clock Frequency 50MHz
Memory Format FLASH
Memory Interface SPI - Dual I/O
Write Cycle Time - Word, Page 97μs, 6ms
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
12,000 $0.35975 $4.317
GD25LD40CEIGR Product Details

GD25LD40CEIGR Overview


There is a memory type Non-Volatile for this type of device. You can get memory ics in a Tape & Reel (TR) case. In the case of 8-XFDFN Exposed Pad, it is embedded within the case. There is an 4Mb 512K x 8 memory capacity on the chip. There is a FLASH-format memory used in this device, which is the memory format used by mainstream devices. This device has an extended operating temperature range of -40°C~85°C TA, so it's perfect for a wide range of demanding applications. With 1.65V~2V as the supply voltage, it is capable of handling memory ics. The recommended mounting type for this device is Surface Mount. In the memory, there is a clock frequency rotation that ranges 50MHz.

GD25LD40CEIGR Features


Package / Case: 8-XFDFN Exposed Pad

GD25LD40CEIGR Applications


There are a lot of GigaDevice Semiconductor (HK) Limited GD25LD40CEIGR Memory applications.

  • eSRAM
  • supercomputers
  • Cache memory
  • eDRAM
  • servers
  • data buffer
  • workstations,
  • multimedia computers
  • telecommunications
  • networks

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