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H8504-05

H8504-05

H8504-05

Harwin Inc.

Harwin Circuit Board Hardware - PCB .8mm PC BOARD SOCKET GOLD

SOT-23

H8504-05 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 9 Weeks
Contact Material Beryllium Copper
Mount Through Hole
Material Brass
Mounting Hole Diameter 0.075 ~ 0.079 (1.91mm ~ 2.01mm)
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2009
JESD-609 Code e4
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
HTS Code 8536.90.40.00
Contact Finish Gold
Number of Contacts 1
Hole Diameter 2.0066 mm
Flange Diameter 0.093 (2.36mm)
Outside Diameter 2.35 mm
Tail Type No Tail
Accepts Pin Diameter 0.024 ~ 0.033 (0.60mm ~ 0.85mm)
Socket Depth 0.183 4.65mm
Insertion Force 1.50N ~ 5.01N
Length 5.6896mm
Contact Finish Thickness 5.90μin 0.150μm
Length - Overall 0.224 5.69mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $0.597309 $0.597309
10 $0.563499 $5.63499
100 $0.531603 $53.1603
500 $0.501512 $250.756
1000 $0.473125 $473.125

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