Shield Finger 0.090 2.28mm 0.346 8.79mm 0.140 3.55mm EZ BoardWare Copper Alloy 3.556mm -40°C~125°C Tin
SOT-23
S2711-06R Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
SMD/SMT
Material
Copper Alloy
Operating Temperature
-40°C~125°C
Packaging
Tape & Reel (TR)
Series
EZ BoardWare
Published
2012
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Type
Shield Finger
Plating
Tin
Attachment Method
Solder
Hole Diameter
1.78 mm
Height
0.140 3.55mm
Length
0.346 8.79mm
Width
0.090 2.28mm
Plating Thickness
118.11μin 3.00μm
Thickness
3.556mm
RoHS Status
Non-RoHS Compliant
S2711-06R Product Details
S2711-06R Overview
The Contact RFI is packaged with the materials of Copper Alloy.The EMI/RFI operates normally at -40°C~125°C. The RFI and EMI contact' packaging Tape & Reel (TR) provides high reliability.The RFI and EMI contact is convenient for international shipping since it is packaged in SMD/SMT.Type Shield Finger from the contacter RFI.As you may know, this RFI EMI comes from the well-known EZ BoardWare series product line.
S2711-06R Features
SMD/SMT package Shield Finger Tape & Reel (TR) is used EZ BoardWare series
S2711-06R Applications
There are a lot of Harwin Inc. S2711-06R RFI and EMI Contacts applications.