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DF37C-30DP-0.4V(51)

DF37C-30DP-0.4V(51)

DF37C-30DP-0.4V(51)

Hirose Electric Co Ltd

DF37C-30DP-0.4V(51) datasheet pdf and Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) product details from Hirose Electric Co Ltd stock available on our website

SOT-23

DF37C-30DP-0.4V(51) Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Material Bronze
Mount Surface Mount
Mounting Type Surface Mount
Packaging Tape & Reel (TR)
Series DF37
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination SMD/SMT
Connector Type Header, Outer Shroud Contacts
Number of Positions 30
Max Operating Temperature 85°C
Min Operating Temperature -35°C
Number of Rows 2
Voltage - Rated 30V
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Pitch 0.016 0.40mm
Total Number of Contacts 30
Reach Compliance Code unknown
Current Rating 300mA
Contact Finish Gold
Mating Information MULTIPLE MATING PARTS AVAILABLE
Contact Gender MALE
Insulation Resistance 50MOhm
Contact Finish Thickness 2.00μin 0.051μm
Height Above Board 0.030 0.75mm
Stack Height (Mating) 0.98mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
8,000 $0.54530 $4.3624
DF37C-30DP-0.4V(51) Product Details

DF37C-30DP-0.4V(51) Overview


You get it in Header, Outer Shroud Contacts packaging.Packaged in a Tape & Reel (TR) case.Mounting type Surface Mount is selected for the device.This product is in the DF37 Series.A Surface Mount socket is needed to mount this.If the temperature is below 85°C, it's best to use it.Temperatures below -35°C are required for this device.

DF37C-30DP-0.4V(51) Features


DF37 series
Package / Case: Tape & Reel (TR)
Mounting Type:Surface Mount
Max Operating temperature at -35°C

DF37C-30DP-0.4V(51) Applications


There are a lot of Hirose Electric Co Ltd DF37C-30DP-0.4V(51) Rectangular Connectors applications.

  • Telecommunications
  • Embedded systems
  • Medical technology
  • Automotive Electronics
  • Datacom
  • Data Technology
  • Communication
  • Transportation
  • Military Technology
  • Industrial Automation

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