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TF38-24S-0.5SV(830)

TF38-24S-0.5SV(830)

TF38-24S-0.5SV(830)

Hirose Electric Co Ltd

TF38-24S-0.5SV(830) datasheet pdf and FFC, FPC (Flat Flexible) Connectors product details from Hirose Electric Co Ltd stock available on our website

SOT-23

TF38-24S-0.5SV(830) Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Contact Material Phosphor Bronze
Mounting Type Surface Mount, Right Angle
Housing Material Liquid Crystal Polymer (LCP)
Actuator Material Liquid Crystal Polymer (LCP)
Operating Temperature -40°C~85°C
Packaging Tape & Reel (TR)
Series TF38
Feature Zero Insertion Force (ZIF)
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Number of Positions 24
Voltage - Rated 50V
Current Rating (Amps) 0.5A
Pitch 0.020 0.50mm
Contact Finish Gold
Housing Color Beige
Mating Cycles 20
Flat Flex Type FFC, FPC
Connector/Contact Type Contacts, Vertical - 1 Sided
Cable End Type Tabbed
Locking Feature Flip Lock
Actuator Color Black
Contact Finish Thickness 1.18μin 0.030μm
Height Above Board 0.205 5.20mm
FFC, FCB Thickness 0.30mm
Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $1.416000 $1.416
10 $1.335849 $13.35849
100 $1.260235 $126.0235
500 $1.188901 $594.4505
1000 $1.121605 $1121.605
TF38-24S-0.5SV(830) Product Details

TF38-24S-0.5SV(830) Overview


Mounting type Surface Mount, Right Angle is assigned to the device.We pack the product in a Tape & Reel (TR) case.There is a product in the TF38 Series.In many ways, Zero Insertion Force (ZIF) makes it more powerful.-40°C~85°C Operating Temperature is the default.

TF38-24S-0.5SV(830) Features


TF38 series

TF38-24S-0.5SV(830) Applications


There are a lot of Hirose Electric Co Ltd TF38-24S-0.5SV(830) FFC, FPC (Flat Flexible) Connectors applications.

  • Instrumentation
  • Data Technology
  • Telecommunications
  • Industrial Automation
  • Military Technology
  • Electrical substations
  • Automotive Electronics
  • Embedded systems
  • Medical technology
  • Anywhere power is distributed

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