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108HSM025M

108HSM025M

108HSM025M

Illinois Capacitor

CAP ALUM 1000UF 20% 25V T/H

SOT-23

108HSM025M Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 15 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can
Terminal Shape WIRE
Dielectric MaterialALUMINUM (WET)
Operating Temperature-40°C~125°C
PackagingBulk
Published 2016
Series HSM
Size / Dimension 0.492Dia 12.50mm
Tolerance ±20%
JESD-609 Code e3
Pbfree Code yes
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Applications General Purpose
Voltage - Rated 25V
Capacitance 1000μF
Lead Pitch 5.0038mm
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
ESR (Equivalent Series Resistance) 232mOhm @ 120Hz
Lead Spacing0.197 5.00mm
Rated (DC) Voltage (URdc) 25V
Lifetime @ Temp 2000 Hrs @ 125°C
Leakage Current 0.75mA
Ripple Current700mA
Polarization Polar
Life (Hours) 2000 hours
Tan Delta 0.14
Ripple Current @ Low Frequency 700mA @ 120Hz
Ripple Current @ High Frequency 840mA @ 10kHz
Height Seated (Max) 1.043 26.50mm
RoHS StatusRoHS Compliant
In-Stock:1083 items

About 108HSM025M

The 108HSM025M from Illinois Capacitor is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 1000UF 20% 25V T/H.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 108HSM025M, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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