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338KBM025M

338KBM025M

338KBM025M

Illinois Capacitor

CAP ALUM 3300UF 20% 25V T/H

SOT-23

338KBM025M Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 22 Weeks
Mounting Type Through Hole
Package / Case Radial, Can
Surface MountNO
Terminal Shape WIRE
Dielectric MaterialALUMINUM (WET)
Operating Temperature-40°C~105°C
PackagingBulk
Published 2016
Series KBM
Size / Dimension 0.630Dia 16.00mm
Tolerance ±20%
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Applications General Purpose
Voltage - Rated 25V
Capacitance 3300μF
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
ESR (Equivalent Series Resistance) 101mOhm @ 120Hz
Lead Spacing0.295 7.50mm
Rated (DC) Voltage (URdc) 25V
Lifetime @ Temp 10000 Hrs @ 105°C
Leakage Current 0.825mA
Polarization Polar
Tan Delta 0.2
Impedance20mOhm
Ripple Current @ Low Frequency 2.19A @ 120Hz
Ripple Current @ High Frequency 2.92A @ 100kHz
Height Seated (Max) 1.260 32.00mm
RoHS StatusROHS3 Compliant
In-Stock:8285 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About 338KBM025M

The 338KBM025M from Illinois Capacitor is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 3300UF 20% 25V T/H.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 338KBM025M, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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