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477RZM025M

477RZM025M

477RZM025M

Illinois Capacitor

CAP ALUM 470UF 20% 25V THRU HOLE

SOT-23

477RZM025M Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 15 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Can
Terminal Shape WIRE
Dielectric MaterialALUMINUM (WET)
Operating Temperature-55°C~105°C
PackagingBulk
Published 2016
Series RZM
Size / Dimension 0.394Dia 10.00mm
Tolerance ±20%
JESD-609 Code e3
Pbfree Code yes
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Applications General Purpose
Voltage - Rated 25V
Capacitance 470μF
Lead Pitch 5.0038mm
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
ESR (Equivalent Series Resistance) 564mOhm @ 120Hz
Lead Spacing0.197 5.00mm
Rated (DC) Voltage (URdc) 25V
Lifetime @ Temp 3000 Hrs @ 105°C
Leakage Current 0.3525mA
Ripple Current725mA
Polarization Polar
Life (Hours) 3000 hours
Tan Delta 0.16
Impedance273mOhm
Custom Capabilities Tape & Reel, Formed Leads, Epoxy Ends
Height Seated (Max) 0.709 18.00mm
RoHS StatusRoHS Compliant
In-Stock:2342 items

About 477RZM025M

The 477RZM025M from Illinois Capacitor is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 470UF 20% 25V THRU HOLE.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 477RZM025M, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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