BGF110E6327XT Overview

In package 24-UFBGA, WLCSP, you will find the ICs.This module is included in a package named Tape & Reel (TR).Integrated circuit is mounted using the way of Surface Mount.The Filter, HSMMC with ESD Protection type is available in many integrated circuits.By searching for the BGF110 family, similar integrated circuit systems may be found.In this case, it would be appropriate to apply the ICs in HSMMC (High Speed Multi Media Card).As far as the ICs applications is concerned, there are 24 pins available.Surface Mount would be a good mounting option for this ICs application.When integrated circuit chip's temperatures are below 85°C, you should utilize it.The integrated circuit system should not operate lower than -40°C operating temperature.The ICs complete is packaged by WLP-24-2.

BGF110E6327XT Features

Applications : HSMMC (High Speed Multi Media Card)
Supplier Device Package : WLP-24-2

BGF110E6327XT Applications

There are a lot of Infineon Technologies BGF110E6327XT Specialized ICs applications.

• All converters requiring very low standby power
• DeviceNet Applications
• Reference Design License Management
• Message Security
• Ecosystem Control
• Portable Instruments
• Isolated CAN Bus Interface
• Peripheral Authentication
• IoT Node Authentication
• Secure Management of Limited Use Consumables