BGF117E6328XTSA1 Overview

In the package 16-UFBGA, WLCSP, the ICs is enclosed.The package Tape & Reel (TR) contains integrated circuit.A mounting method of Surface Mount is used.The Filter, HSMMC with ESD Protection is available in a wide range of integrated circuits.In order to find similar integrated circuit systems, you should search for the family BGF117.In HSMMC (High Speed Multi Media Card), the ICs is appropriate.In order to make this ICs application work properly, it should be mounted at Surface Mount.When integrated circuit chip's temperatures are below 85°C, you should utilize it.Temperatures below -40°C should not be allowed on the integrated circuit system.

BGF117E6328XTSA1 Features

Applications : HSMMC (High Speed Multi Media Card)

BGF117E6328XTSA1 Applications

There are a lot of Infineon Technologies BGF117E6328XTSA1 Specialized ICs applications.

• PC-Based Instruments
• Appliances requiring ErP Lot 6 compliance
• IoT Node Authentication
• μP Switch Interfacing
• Anti-cloning
• Membrane Keypads
• PDAs and Palmtop Devices
• All converters requiring very low standby power
• Adapters requiring ultra low no-load consumption
• Lossless generation of zero crossing signal