BGSA131MN10E6327XTSA1 Overview

Due to the enhanced 10-XFQFN Exposed Pad package, this RF IC is excellent .The RF modulator is packaged in a Tape & Reel (TR) package.PCB or development board with Surface Mount-type connectors can accommodate this RF modulator.

BGSA131MN10E6327XTSA1 Features

10-XFQFN Exposed Pad package
Tape & Reel (TR)

BGSA131MN10E6327XTSA1 Applications

There are a lot of Infineon Technologies BGSA131MN10E6327XTSA1 RF Misc ICs and Modules applications.

• Automotive radar
• PA linearization
• Balanced modulation
• Test and Measurement
• Cellular base stations
• Point-to-point radios
• Radio links
• Automotive
• Fixed wireless access
• Synchronous detection