BGSA133GN10E6327XTSA1 Overview

This RF IC is excellent due to its enhanced 10-XFQFN Exposed Pad package.Tape & Reel (TR) package is used for this RF modulator.PCBs or development boards with Surface Mount-types can accommodate this RF modulator.

BGSA133GN10E6327XTSA1 Features

10-XFQFN Exposed Pad package
Tape & Reel (TR)

BGSA133GN10E6327XTSA1 Applications

There are a lot of Infineon Technologies BGSA133GN10E6327XTSA1 RF Misc ICs and Modules applications.

• Point-to-point radios
• Phase detection
• RF/IF analog multiplexer
• Demodulation
• Blind spot detection
• Self-parking
• Cellular Infrastructure
• Balanced modulation
• Cellular base stations
• Automotive