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D1301SH45TXPSA1

D1301SH45TXPSA1

D1301SH45TXPSA1

Infineon Technologies

DIODE GEN PURP 4.5KV 1740A

SOT-23

D1301SH45TXPSA1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 36 Weeks
Mounting Type Chassis Mount
Package / Case DO-200AE
Surface MountYES
Diode Element Material SILICON
PackagingBulk
Published 2016
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 2
ECCN Code EAR99
HTS Code8541.10.00.80
Terminal Position END
Terminal FormNO LEAD
JESD-30 Code O-CEDB-N2
Operating Temperature (Max) 140°C
Number of Elements 1
Configuration SINGLE
Speed Standard Recovery >500ns, > 200mA (Io)
Diode Type Standard
Current - Reverse Leakage @ Vr 150mA @ 4500V
Voltage - Forward (Vf) (Max) @ If 4.3V @ 2500A
Operating Temperature - Junction 0°C~140°C
Output Current-Max 1740A
Application POWER
Voltage - DC Reverse (Vr) (Max) 4500V
Current - Average Rectified (Io) 1740A
Number of Phases 1
Rep Pk Reverse Voltage-Max 4500V
Non-rep Pk Forward Current-Max 28000A
Reverse Current-Max 150000μA
RoHS StatusNon-RoHS Compliant
In-Stock:40 items

Pricing & Ordering

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About D1301SH45TXPSA1

The D1301SH45TXPSA1 from Infineon Technologies is a high-performance microcontroller designed for a wide range of embedded applications. This component features DIODE GEN PURP 4.5KV 1740A.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the D1301SH45TXPSA1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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