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DF80R12W2H3FB11BPSA1

DF80R12W2H3FB11BPSA1

DF80R12W2H3FB11BPSA1

Infineon Technologies

DF80R12W2H3FB11BPSA1 datasheet pdf and Transistors - IGBTs - Modules product details from Infineon Technologies stock available on our website

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DF80R12W2H3FB11BPSA1 Datasheet

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Specifications
Name Value
Type Parameter
Factory Lead Time 16 Weeks
Mounting Type Chassis Mount
Package / Case Module
Surface Mount NO
Transistor Element Material SILICON
Operating Temperature -40°C~150°C TJ
Published 2002
Series EconoPACK™2
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 22
ECCN Code EAR99
Terminal Position UPPER
Terminal Form UNSPECIFIED
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-XUFM-X22
Number of Elements 2
Configuration Half Bridge
Case Connection ISOLATED
Power - Max 20mW
Transistor Application POWER CONTROL
Polarity/Channel Type N-CHANNEL
Input Standard
Current - Collector Cutoff (Max) 1mA
Voltage - Collector Emitter Breakdown (Max) 1200V
Current - Collector (Ic) (Max) 20A
Turn On Time 40 ns
Vce(on) (Max) @ Vge, Ic 1.7V @ 15V, 20A
Turn Off Time-Nom (toff) 375 ns
IGBT Type Trench Field Stop
NTC Thermistor Yes
Input Capacitance (Cies) @ Vce 2.35nF @ 25V
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $154.380000 $154.38
10 $145.641509 $1456.41509
100 $137.397650 $13739.765
500 $129.620425 $64810.2125
1000 $122.283420 $122283.42
DF80R12W2H3FB11BPSA1 Product Details

DF80R12W2H3FB11BPSA1 Description


FF200R12KE3HOSA1 IGBT module developed by Infineon Technologies is a modular semiconductor product which is packaged by IGBT (insulated gate bipolar transistor chip) and FWD (freewheeling diode chip) through a specific circuit bridge; the packaged IGBT module is directly used in frequency converters, UPS uninterrupted power supply and other equipment. IGBT modules have the characteristics of energy saving, convenient installation and maintenance, and stable heat dissipation. IGBT module is the core device for energy conversion and transmission, commonly known as the "CPU" of power electronic devices. As a national strategic emerging industry, it is widely used in rail transit, smart grid, aerospace, electric vehicles and new energy equipment.



DF80R12W2H3FB11BPSA1 Features


Low switching losses

Al2O3 substrate with low thermal resistance

Compact design

CoolSiC(TM) Schottky diode gen 5



DF80R12W2H3FB11BPSA1 Applications


Solar applications


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