Description

The IRF6100 is a HEXFET? Power MOSFET. International Rectifier offers genuine chip-scale packaging. Extremely low on-resistance and the highest power densities in the industry have been made accessible for battery and load management applications through the use of cutting-edge processing techniques and a novel packaging architecture. These advantages, along with the ruggedized device design for which International Rectifier is renowned, give the designer access to a very effective and dependable tool.

The FlipFET? package has a profile of less than.8mm and has a footprint that is one-third that of a comparable SOT-23 package. This makes the FlipFET? the ideal device for applications where printed circuit board space is at a premium and in extremely thin application contexts, such as battery packs, cell phones, and PCMCIA cards. This is combined with the low thermal resistance of the die-level device.

Features

• One-third Footprint of SOT-23

• Super Low Profile (<.8mm)

• Available Tested on Tape & Reel

• Ultra Low RDS(on) per Footprint Area

• Low Thermal Resistance

• P-Channel MOSFET

Applications

• Battery packs

• Cell phones

• PCMCIA cards

• Solar inverters

• Automotive applications

• Switch, buck and synchronous rectification

• Small motor control