IRFZ48VS Description

International Rectifier's innovative HEXFET? Power MOSFETs use cutting-edge processing methods to produce extraordinarily low on-resistance per silicon area. This feature offers the designer a highly efficient and dependable device for usage in a range of applications, in addition to the quick switching speed and ruggedized device architecture that HEXFET power MOSFETs are widely known for.

A surface mount power package called the D2Pak may accommodate die sizes as large as HEX-4. In comparison to other surface mount packages, it offers the largest power capacity and the least amount of on-resistance. Due to its low internal connection resistance and ability to dissipate up to 2.0W in a typical surface mount application, the D2Pak is appropriate for high current applications.

IRFZ48VS Features

• Advanced Process Technology

• Ultra Low On-Resistance

• Dynamic dv/dt Rating

• 175°C Operating Temperature

• Fast Switching

• Fully Avalanche Rated

• Optimized for SMPS Applications

IRFZ48VS Applications

• Power Management

• Consumer Electronics

• Portable Devices

• Industrial