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IRL1404S

IRL1404S

IRL1404S

Infineon Technologies

IRL1404S datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website

SOT-23

IRL1404S Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Operating Temperature -55°C~175°C TJ
Packaging Tube
Published 2002
Series HEXFET®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Technology MOSFET (Metal Oxide)
Power Dissipation-Max 3.8W Ta 200W Tc
FET Type N-Channel
Rds On (Max) @ Id, Vgs 4m Ω @ 95A, 10V
Vgs(th) (Max) @ Id 3V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 6600pF @ 25V
Current - Continuous Drain (Id) @ 25°C 160A Tc
Gate Charge (Qg) (Max) @ Vgs 140nC @ 5V
Drain to Source Voltage (Vdss) 40V
Drive Voltage (Max Rds On,Min Rds On) 4.3V 10V
Vgs (Max) ±20V
RoHS Status Non-RoHS Compliant
IRL1404S Product Details

IRL1404S Description


IRL1404S is an N-channel Power MOSFET transistor from the manufacturer Infineon Technologies with a voltage of 40V. The operating temperature of the IRL1404S is -55°C~175°C TJ and its maximum power dissipation is 3.8W Ta. IRL1404S has 2 pins and it is available in Tube packaging way. The Drain to Source Voltage (Vdss) of the IRL1404S is 40V.



IRL1404S Features


  • Planar cell structure for wide SOA

  • Optimized for broadest availability from distribution partners

  • Product qualification according to JEDEC standard

  • Silicon optimized for applications switching below <100kHz

  • Industry standard surface-mount power package

  • High-current carrying capability package (up to 195 A, die-size dependent)

  • Capable of being wave-soldered



IRL1404S Applications


  • Optimized for broadest availability from distribution partners

  • Product qualification according to JEDEC standard

  • Logic level : Optimized for 10 V gate drive voltage, capable of 4.5 V gate drive voltage

  • Industry standard surface-mount power package

  • High-current carrying capability package (up to 195 A, die-size dependent)

  • Capable of being wave-soldered


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