IRLI2505 Description

International Rectifier's Fifth Generation HEXFETs use cutting-edge manufacturing methods to provide the lowest on-resistance per silicon area. This feature gives the designer a very effective device for usage in a range of applications, in addition to the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are widely known for.

In commercial and industrial applications, the TO-220 Fullpak replaces the requirement for additional insulating gear. Between the tab and external heatsink, the molding material employed has a strong thermal isolation capability. This isolation is comparable to employing a mica barrier with a conventional TO-220 product that is 100 microns thick. A single clip or single screw can be used to fix the Fullpak to a heatsink.

IRLI2505 Features

• Logic-Level Gate Drive

• Advanced Process Technology

• Ultra Low On-Resistance

• Isolated Package

• High Voltage Isolation = 2.5KVRMS ?

• Sink to Lead Creepage Dist. = 4.8mm

• Fully Avalanche Rated

IRLI2505 Applications

• Power Management

• Consumer Electronics

• Portable Devices

• Industrial