IRLI2505 Description
International Rectifier's Fifth Generation HEXFETs use cutting-edge manufacturing methods to provide the lowest on-resistance per silicon area. This feature gives the designer a very effective device for usage in a range of applications, in addition to the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are widely known for.
In commercial and industrial applications, the TO-220 Fullpak replaces the requirement for additional insulating gear. Between the tab and external heatsink, the molding material employed has a strong thermal isolation capability. This isolation is comparable to employing a mica barrier with a conventional TO-220 product that is 100 microns thick. A single clip or single screw can be used to fix the Fullpak to a heatsink.
IRLI2505 Features
Logic-Level Gate Drive
Advanced Process Technology
Ultra Low On-Resistance
Isolated Package
High Voltage Isolation = 2.5KVRMS ?
Sink to Lead Creepage Dist. = 4.8mm
Fully Avalanche Rated
IRLI2505 Applications
Power Management
Consumer Electronics
Portable Devices
Industrial
