IRLI2910 datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website
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IRLI2910 Datasheet
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Specifications
Name
Value
Type
Parameter
Mounting Type
Through Hole
Package / Case
TO-220-3 Full Pack
Surface Mount
NO
Transistor Element Material
SILICON
Operating Temperature
-55°C~175°C TJ
Packaging
Tube
Published
1998
Series
HEXFET®
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
3
ECCN Code
EAR99
Additional Feature
AVALANCHE RATED
Technology
MOSFET (Metal Oxide)
Terminal Position
SINGLE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PSFM-T3
Qualification Status
Not Qualified
Number of Elements
1
Configuration
SINGLE WITH BUILT-IN DIODE
Power Dissipation-Max
63W Tc
Operating Mode
ENHANCEMENT MODE
Case Connection
ISOLATED
FET Type
N-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
26m Ω @ 16A, 10V
Vgs(th) (Max) @ Id
2V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
3700pF @ 25V
Current - Continuous Drain (Id) @ 25°C
31A Tc
Gate Charge (Qg) (Max) @ Vgs
140nC @ 5V
Drain to Source Voltage (Vdss)
100V
Drive Voltage (Max Rds On,Min Rds On)
4V 10V
Vgs (Max)
±16V
JEDEC-95 Code
TO-220AB
Drain Current-Max (Abs) (ID)
31A
Drain-source On Resistance-Max
0.03Ohm
Pulsed Drain Current-Max (IDM)
190A
DS Breakdown Voltage-Min
100V
Avalanche Energy Rating (Eas)
520 mJ
RoHS Status
Non-RoHS Compliant
IRLI2910 Product Details
Description
The IRLI2910 is a 100V Single N-Channel HEXFET Power MOSFET in a TO-220 FullPak (Iso) package. International Rectifier's Fifth Generation HEXFETs use cutting-edge processing methods to achieve exceptionally low on-resistance per silicon area. This feature offers the designer a highly effective and dependable device for usage in various applications, in addition to the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are widely known for.
In commercial and industrial applications, the TO-220 Full Pak eliminates the need for additional insulating gear. The molding material utilized offers thermal solid isolation between the tab and external heat sink and low thermal resistance. This isolation is comparable to employing a mica barrier with a conventional TO-220 product that is 100 microns thick. A single clip or single screw can be used to fix the Fullpak to a heat sink.