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IRLI2910

IRLI2910

IRLI2910

Infineon Technologies

IRLI2910 datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website

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IRLI2910 Datasheet

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Specifications
Name Value
Type Parameter
Mounting Type Through Hole
Package / Case TO-220-3 Full Pack
Surface Mount NO
Transistor Element Material SILICON
Operating Temperature -55°C~175°C TJ
Packaging Tube
Published 1998
Series HEXFET®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3
ECCN Code EAR99
Additional Feature AVALANCHE RATED
Technology MOSFET (Metal Oxide)
Terminal Position SINGLE
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PSFM-T3
Qualification Status Not Qualified
Number of Elements 1
Configuration SINGLE WITH BUILT-IN DIODE
Power Dissipation-Max 63W Tc
Operating Mode ENHANCEMENT MODE
Case Connection ISOLATED
FET Type N-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 26m Ω @ 16A, 10V
Vgs(th) (Max) @ Id 2V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 3700pF @ 25V
Current - Continuous Drain (Id) @ 25°C 31A Tc
Gate Charge (Qg) (Max) @ Vgs 140nC @ 5V
Drain to Source Voltage (Vdss) 100V
Drive Voltage (Max Rds On,Min Rds On) 4V 10V
Vgs (Max) ±16V
JEDEC-95 Code TO-220AB
Drain Current-Max (Abs) (ID) 31A
Drain-source On Resistance-Max 0.03Ohm
Pulsed Drain Current-Max (IDM) 190A
DS Breakdown Voltage-Min 100V
Avalanche Energy Rating (Eas) 520 mJ
RoHS Status Non-RoHS Compliant
IRLI2910 Product Details

Description


The IRLI2910 is a 100V Single N-Channel HEXFET Power MOSFET in a TO-220 FullPak (Iso) package. International Rectifier's Fifth Generation HEXFETs use cutting-edge processing methods to achieve exceptionally low on-resistance per silicon area. This feature offers the designer a highly effective and dependable device for usage in various applications, in addition to the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are widely known for.

In commercial and industrial applications, the TO-220 Full Pak eliminates the need for additional insulating gear. The molding material utilized offers thermal solid isolation between the tab and external heat sink and low thermal resistance. This isolation is comparable to employing a mica barrier with a conventional TO-220 product that is 100 microns thick. A single clip or single screw can be used to fix the Fullpak to a heat sink.



Features


  • Fast Switching

  • High Voltage Isolation = 2.5KVRMS ?

  • Sink to Lead Creepage Dist. = 4.8mm

  • Fully Avalanche Rated

  • Lead-Free

  • Logic ¨CLevel Gate Drive

  • Advanced Process Technology

  • Ultra Low On-Resistance

  • Isolated Package



Applications


  • Switch Mode Power Supplies (SMPS)

  • Power-Over-Ethernet (PoE)

  • Solar inverters

  • Automotive applications

  • Switch, buck and synchronous rectification

  • Uninterruptible Power Supplies (UPS)

  • Small motor control


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