PEB 20256 E V2.1 Overview

Space is saved on the board by using the 388-BBGA package.Packing is done according to the Tray method.Telecommunications equipment is mounted with type Surface Mount.When 3V~3.6V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.Using 0°C~70°C as the operating temperature can result in reliable performance.By using telecom switching's base part number of PEB20256, it is possible to find more related parts.There is a supply current of 200mA for telecom equipment to operate on.

PEB 20256 E V2.1 Features

Available in the 388-BBGA package

PEB 20256 E V2.1 Applications

There are a lot of Infineon Technologies PEB 20256 E V2.1 Telecom applications.

• Remote wireless modules
• ISDN terminal adapter
• Interfaces to DS3
• Inverse Multiplexing for ATM (IMA) Wireless Base Stations
• Integrated Access Devices
• Frame Relay Switches and Access Devices (FRADS)
• SONET/SDH terminal
• Voice over packet gateways
• Interfaces to E3
• CSU/DSU E1 Interface