PEB 3164 F V1.1 Overview

Saving board space is achieved with the 64-LQFP package.Telecommunications equipment is packed using the Tray method.A Surface Mount mounting type is used.The telecom IC is composed of 1 circuits.Operating temperatures of 0°C~70°C can ensure reliable performance.The PEB3164 base part number can be used to find more related parts.

PEB 3164 F V1.1 Features

Available in the 64-LQFP package

PEB 3164 F V1.1 Applications

There are a lot of Infineon Technologies PEB 3164 F V1.1 Telecom applications.

• Fiber In The Loop (FITL)
• DECT (Digital European Cordless Telephone) Base Stations
• High-Density T1/E1/J1 interfaces for Multiplexers
• Inverse Multiplexing for ATM (IMA)
• Digital Access Cross-connect System (DACs)
• SONET/SDH terminal
• Cable Telephony
• Inverse Multiplexing for ATM (IMA) Wireless Base Stations
• Hybrid fiber coax (HFC)
• ISDN Primary Rate Interfaces (PRA)