PEF 20512 E V1.2-G Overview

In order to save space on the board, 323-BBGA, FCBGA packages are used.Telecommunications equipment is packed using the Tray method.A Surface Mount mounting type is used.-40°C~85°C is a temperature setting that is reliable when telecom switching comes to performance.The PEF20512 base part number can be used to find more related parts.

PEF 20512 E V1.2-G Features

Available in the 323-BBGA, FCBGA package

PEF 20512 E V1.2-G Applications

There are a lot of Infineon Technologies PEF 20512 E V1.2-G Telecom applications.

• CSU/DSU Equipment
• High speed data transmission line cards
• Channel Banks
• Integrated Access Devices
• DSLAMs
• ISDN Primary Rate Interfaces (PRA)
• Remote wireless modules
• Residential Gateways
• T1/E1/J1 Multiplexer and Channel Banks
• Interfaces to SONET STS-1 Networks