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PEF 22552 E V1.1-G

PEF 22552 E V1.1-G

PEF 22552 E V1.1-G

Infineon Technologies

PEF22552 Telecom device2 Circuits

SOT-23

PEF 22552 E V1.1-G Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 160-LBGA
Supplier Device Package P/PG-LBGA-160-1
Operating Temperature-40°C~85°C
PackagingTray
Series DualFALC™
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Power (Watts) 150mW
Voltage - Supply 1.8V 3.3V
Base Part Number PEF22552
Function Framer, Line Interface Unit (LIU)
Interface E1, J1, SCI, SPI, T1
Number of Circuits 2
In-Stock:2879 items

PEF 22552 E V1.1-G Product Details

PEF 22552 E V1.1-G Overview


To save board space, the 160-LBGA package is used.For telecommunications equipment packing, the Tray method is used.The mounting type of this telecom circuit is Surface Mount.Telecom circuit is made up of 2 circuits.When the voltage for 1.8V 3.3V is provided, improved efficiency can be achieved.Telecom switching is possible to achieve reliable performance when the operating temperature is set at -40°C~85°C.PEF22552 can be used to locate related parts based on telecom switching's base part number.With its similar functionality to electronic parts under the DualFALC? series, it can perform a number of similar tasks.

PEF 22552 E V1.1-G Features


Available in the 160-LBGA package

PEF 22552 E V1.1-G Applications


There are a lot of Infineon Technologies PEF 22552 E V1.1-G Telecom applications.

  • Digital loop carrier (DLC)
  • PBXs channel bank
  • E1 LAN/WAN Routers
  • Multichannel DS1 Test Equipment
  • T3 channelized access concentrators
  • Router
  • Switching Systems
  • SONET/SDH terminal
  • Integrated Multi-Service Access Platforms (IMAPs)
  • Fractional T1/E1/J1

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