PEF 22552 E V1.1-G Overview

To save board space, the 160-LBGA package is used.For telecommunications equipment packing, the Tray method is used.The mounting type of this telecom circuit is Surface Mount.Telecom circuit is made up of 2 circuits.When the voltage for 1.8V 3.3V is provided, improved efficiency can be achieved.Telecom switching is possible to achieve reliable performance when the operating temperature is set at -40°C~85°C.PEF22552 can be used to locate related parts based on telecom switching's base part number.With its similar functionality to electronic parts under the DualFALC? series, it can perform a number of similar tasks.

PEF 22552 E V1.1-G Features

Available in the 160-LBGA package

PEF 22552 E V1.1-G Applications

There are a lot of Infineon Technologies PEF 22552 E V1.1-G Telecom applications.

• Digital loop carrier (DLC)
• PBXs channel bank
• E1 LAN/WAN Routers
• Multichannel DS1 Test Equipment
• T3 channelized access concentrators
• Router
• Switching Systems
• SONET/SDH terminal
• Integrated Multi-Service Access Platforms (IMAPs)
• Fractional T1/E1/J1