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PEF 22554 E V2.1-G

PEF 22554 E V2.1-G

PEF 22554 E V2.1-G

Infineon Technologies

PEF22554 Telecom device4 Circuits

SOT-23

PEF 22554 E V2.1-G Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 160-LBGA
Supplier Device Package P/PG-LBGA-160-1
Operating Temperature -40°C~85°C
Packaging Tray
Series QuadFALC™
Part Status Obsolete
Moisture Sensitivity Level (MSL) 2A (4 Weeks)
Voltage - Supply 1.8V 3.3V
Base Part Number PEF22554
Function Framer, Line Interface Unit (LIU)
Interface E1, HDLC, J1, T1
Number of Circuits 4
PEF 22554 E V2.1-G Product Details

PEF 22554 E V2.1-G Overview


Space is saved on the board by using the 160-LBGA package.Telecommunications equipment is packed in the Tray-way.Mounting type Surface Mount is used.An 4-circuit makes up this telecom IC .When 1.8V 3.3V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.At -40°C~85°C, reliable performance can be achieved.The PEF22554 base part number can be used to find more related parts.The QuadFALC? series is capable of providing a number of similar functions to the W series.

PEF 22554 E V2.1-G Features


Available in the 160-LBGA package

PEF 22554 E V2.1-G Applications


There are a lot of Infineon Technologies PEF 22554 E V2.1-G Telecom applications.

  • PBX interfaces
  • PBXs channel bank
  • Digital Cross-connect Systems (DCS)
  • Central office (CO)
  • T3 channelized access concentrators
  • BITS Timing
  • Add/Drop multiplexers (ADMs)
  • Wireless base stations
  • Public switching systems
  • SDH/SONET multiplexers

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