PEF 22554 E V3.1 Overview

In order to save space on the board, the 160-LBGA package is used.Packing is done according to the Tray method.A Surface Mount mounting type is used.Telecommunications equipment consists of 4 circuits.When 1.8V 3.3V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.The operating temperature set at -40°C~85°C can offer reliable performance.In addition to telecom switching's base part number PEF22554, it can be used to find other related parts.With the QuadFALC? series electronic parts, it can perform similar functions of the telecommunication product .

PEF 22554 E V3.1 Features

Available in the 160-LBGA package

PEF 22554 E V3.1 Applications

There are a lot of Infineon Technologies PEF 22554 E V3.1 Telecom applications.

• Digital subscriber line access multiplexer (DSLAM)
• Dual battery supply voltage SLICs
• Digital access cross connects
• CSU/DSU E1/T1/J1 Interface
• Router
• Integrated Multi-Service Access Platforms (IMAPs)
• Switches
• Residential Gateways
• PCM channel bank
• Cable modem