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PEF 22554 E V3.1

PEF 22554 E V3.1

PEF 22554 E V3.1

Infineon Technologies

PEF22554 Telecom device4 Circuits

SOT-23

PEF 22554 E V3.1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 160-LBGA
Supplier Device Package P/PG-LBGA-160-1
Operating Temperature-40°C~85°C
PackagingTray
Series QuadFALC™
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 1.8V 3.3V
Base Part Number PEF22554
Function Framer, Line Interface Unit (LIU)
Interface E1, HDLC, J1, T1
Number of Circuits 4
RoHS StatusNon-RoHS Compliant
In-Stock:1019 items

PEF 22554 E V3.1 Product Details

PEF 22554 E V3.1 Overview


In order to save space on the board, the 160-LBGA package is used.Packing is done according to the Tray method.A Surface Mount mounting type is used.Telecommunications equipment consists of 4 circuits.When 1.8V 3.3V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.The operating temperature set at -40°C~85°C can offer reliable performance.In addition to telecom switching's base part number PEF22554, it can be used to find other related parts.With the QuadFALC? series electronic parts, it can perform similar functions of the telecommunication product .

PEF 22554 E V3.1 Features


Available in the 160-LBGA package

PEF 22554 E V3.1 Applications


There are a lot of Infineon Technologies PEF 22554 E V3.1 Telecom applications.

  • Digital subscriber line access multiplexer (DSLAM)
  • Dual battery supply voltage SLICs
  • Digital access cross connects
  • CSU/DSU E1/T1/J1 Interface
  • Router
  • Integrated Multi-Service Access Platforms (IMAPs)
  • Switches
  • Residential Gateways
  • PCM channel bank
  • Cable modem

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