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TLE7234E

TLE7234E

TLE7234E

Infineon Technologies

Tape & Reel (TR) Hot Swap Controllers SSOP

SOT-23

TLE7234E Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Package / Case SSOP
Number of Pins 24
Packaging Tape & Reel (TR)
Pbfree Code yes
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 24
ECCN Code EAR99
Resistance 1.6Ohm
Max Operating Temperature 150°C
Min Operating Temperature -40°C
Subcategory Peripheral Drivers
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Pitch 0.635mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 24
Number of Outputs 8
Qualification Status Not Qualified
Max Output Current 1A
Power Supplies 3.3/59/16V
Nominal Supply Current 15mA
Current - Output 350mA
Interface IC Type BUFFER OR INVERTER BASED PERIPHERAL DRIVER
Driver Number of Bits 8
Screening Level AEC-Q100
Output Peak Current Limit-Nom 0.5A
Output Current Flow Direction SINK
RoHS Status RoHS Compliant
TLE7234E Product Details

TLE7234E Overview


You get it with the SSOP package.Hot-swappable device comes in the shape of a Tape & Reel (TR).Hot-swappable device terminates wHot-swappable deviceh 24 in total.Device DUAL is in the terminal position.Total number of pins is 24.Operating the device requires 24 pins.Peripheral Drivers contains this gadget on its own.There is a Surface Mount-axis orientation to it.Stable operation can be achieved with a maximum operating temperature of 150°C°C.Hot-swappable device operates at a minimum temperature of -40°C degrees Celsius in order to ensure reliabilHot-swappable devicey.Part 3.3/59/16V uses a power supply that has a voltage.Hot Swap is defaulted to output 8.When operating criteria are met, the maximum output current is reduced to 1A.Resistance to 1.6Ohm is present in the device.

TLE7234E Features


The terminal position of 24


TLE7234E Applications


There are a lot of Infineon Technologies
TLE7234E hot swap controllers applications.


  • Electric vehicle
  • Avionics systems
  • Safe board insertion and extraction
  • Industrial computers and servers
  • Redundant-array-of-independent-disk (RAID) storage
  • Other forms of communications infrastructure
  • Board or blade insertion into live backplanes
  • Backplane
  • Loads
  • Distributed power systems

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