TLE9461ESV33XUMA1 Overview

Package 24-TSSOP (0.154, 3.90mm Width) Exposed Pad contains the ICs.The Tape & Reel (TR) package contains integrated circuit.A mounting method of Surface Mount is used.The System Basis Chip (SBC) is available in a wide range of integrated circuits.CAN Automotive is the appropriate place to apply the ICs.This electrical ICs application is part of the Automotive, AEC-Q100, Lite SBC series.

TLE9461ESV33XUMA1 Features

Applications : CAN Automotive
It belongs to Automotive, AEC-Q100, Lite SBC Series

TLE9461ESV33XUMA1 Applications

There are a lot of Infineon Technologies TLE9461ESV33XUMA1 Specialized ICs applications.

• Lossless generation of zero crossing signal
• Industrial Networks
• μP Switch Interfacing
• IoT Node Authentication
• MP3 Players
• PDAs and Palmtop Devices
• Peripheral Authentication
• Cell Phones
• Reference Design License Management
• PC-Based Instruments