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6V31023PGGI

6V31023PGGI

6V31023PGGI

Integrated Device Technology (IDT)

3.3V Clock Buffer DUAL 16 Pins

SOT-23

6V31023PGGI Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Surface Mount YES
Number of Pins 16
Published 2006
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 16
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
HTS Code 8542.39.00.01
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 16
Operating Temperature (Max) 85°C
Operating Temperature (Min) -40°C
Supply Voltage-Max (Vsup) 3.465V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 3.135V
Family 6V
Logic IC Type LOW SKEW CLOCK DRIVER
Number of True Outputs 2
Input Conditioning DIFFERENTIAL MUX
Length 5mm
Height Seated (Max) 1.2mm
Width 4.4mm
Thickness 1mm
RoHS Status Non-RoHS Compliant
Lead Free Lead Free
6V31023PGGI Product Details

6V31023PGGI Overview


There are 16 terminations in it. Using a supply voltage of 3.3V allows for high efficiency. It has a number of pins of 16. The 16 pins are utilized for operation. It is part of the 6V family of electronic buffer ICs. It's set to 3.465V for the maximum supply voltage (Vsup). A logic IC with a value of LOW SKEW CLOCK DRIVER is used for this application. To ensure normal operation of the cut smart buffer, the supply voltage (Vsup) should always be kept above 3.135V. It is possible to get 2 true outputs. For stable operation, the maximum operating temperature should not exceed 85°C°C. As part of its reliability, it operates at a minimum of -40°C degrees Celsius.

6V31023PGGI Features


16 terminations
logic IC type of LOW SKEW CLOCK DRIVER


6V31023PGGI Applications


There are a lot of Integrated Device Technology (IDT)
6V31023PGGI Clock Buffers & Drivers applications.


  • High performance communication system
  • Data center
  • Cloud computing
  • Network
  • High speed industry
  • High-end consumer electronics
  • Data communication
  • Telecommunications
  • Computing
  • Medical imaging

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