70P259L65BYGI Overview

RAM, SDR, SRAM is its memory type. It is available in a case with a Bulk shape. As you can see, it is embedded in TFBGA case. There is an 16kB memory capacity on the chip. As you can see from the diagram, the chip is planted with 100 terminations. In total, 1 functions are supported by this part. The memory device designed for this application has been designed to be powered by an 2.6V power supply. It is encased in an 100-pin package that contains this ic memory chip. It has 100 pins indicating it has 100 memory locations. An address can be read and/or written to one memory address using 2 ports on the chip. In addition to this device, there are COMMON-bit memory mapped I/O port addresses on this device. A minimum operating temperature of -40°C must be met by this device. As a general rule, memory ics is recommended that the product be operated at temperatures no higher than 85°Cc, otherwise, damage could be done to it. This memory ics is capable of operating with an input current of 0.07mA at max. This memory ics requires a minimum voltage of 1.8V. In order for it to operate properly, its voltage should not exceed 3V.

70P259L65BYGI Features

Package / Case: TFBGA
100 Pins
I/O Type: COMMON

70P259L65BYGI Applications

There are a lot of Integrated Device Technology (IDT)
70P259L65BYGI Memory applications.

• telecommunications
• workstations,
• DVD disk buffer
• data buffer
• nonvolatile BIOS memory
• Camcorders
• embedded logic
• eDRAM
• graphics card
• hard disk drive (HDD)