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70T3319S133BC

70T3319S133BC

70T3319S133BC

Integrated Device Technology (IDT)

Surface Mount 256 Pin Memory IC 4 Mb kb 17mm mm 370mA mA 18b b

SOT-23

70T3319S133BC Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 7 Weeks
Mount Surface Mount
Number of Pins 256
Packaging Bulk
Published 2010
JESD-609 Code e0
Pbfree Code no
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Lead (Sn63Pb37)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 2.5V
Terminal Pitch 1mm
Frequency 133MHz
Time@Peak Reflow Temperature-Max (s) 20
Pin Count 256
Operating Supply Voltage 2.5V
Temperature Grade COMMERCIAL
Interface Parallel
Max Supply Voltage 2.6V
Min Supply Voltage 2.4V
Memory Size 512kB
Number of Ports 2
Nominal Supply Current 370mA
Memory Type RAM, SDR, SRAM
Frequency (Max) 133MHz
Access Time 4.2 ns
Output Characteristics 3-STATE
Address Bus Width 18b
Density 4 Mb
Standby Current-Max 0.015A
I/O Type COMMON
Sync/Async Synchronous
Word Size 18b
Length 17mm
Height Seated (Max) 1.5mm
Width 17mm
Thickness 1.4mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Contains Lead
Pricing & Ordering
Quantity Unit Price Ext. Price
12 $112.43917 $1349.27004
70T3319S133BC Product Details

70T3319S133BC Overview


A RAM, SDR, SRAM-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Bulk case as well. On the chip, there is an 512kB memory, which is the size of the chip's memory. A total of 256 terminations have been planted on the chip. The comprehensive working procedure of this part involves 1 functions. In order to power this memory device, 2.5V will be necessary. A 256-pin package containing this memory device is used to house this device. The memory device in question has 256 pins, thus indicating that it has 256 memory locations that can be accessed. There is a note indicating that this memory chip operates at an 2.5V volt supply voltage. The memory chip utilizes a straightforward, high-efficiency mounting method, Surface Mount mounting. There is a nominal supply current rating of 370mA for this memory component. This chip features all the merits of a conventional chip, but it also features FLOW-THROUGH OR PIPELINED ARCHITECTURE to improve system performance. 2 ports allow read/write access to one memory address in this chip. As part of the design, the I/O port addresses are mapped into the memory using an COMMON-bit number. There must not be a minimum operating temperature of less than 0°C for this device. A temperature of no more than 70°C centigrade is recommended for the component to be operated, otherwise, damage might be inflicted on the component. Usually, this memory ics falls under the SRAMs component category. Ideally, this part should be supplied with a voltage of at least 2.4V. An operating voltage of no more than 2.6V is required. A frequency of 133MHz is used to process the data on this memory chip. A ic memory chip with this frequency has a maximum speed of 133MHz.

70T3319S133BC Features


256 Pins
Operating Supply Voltage:2.5V
Additional Feature:FLOW-THROUGH OR PIPELINED ARCHITECTURE
I/O Type: COMMON
Freguency at 133MHz
133MHz terminals


70T3319S133BC Applications


There are a lot of Integrated Device Technology (IDT)
70T3319S133BC Memory applications.


  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM
  • graphics card

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