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70T3509MS133BPGI

70T3509MS133BPGI

70T3509MS133BPGI

Integrated Device Technology (IDT)

Surface Mount 256 Pin Memory IC 36 Mb kb 17mm mm 1.37A mA 36b b

SOT-23

70T3509MS133BPGI Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 14 Weeks
Mount Surface Mount
Package / Case BGA
Number of Pins 256
Packaging Bulk
Published 2009
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 2.5V
Terminal Pitch 1mm
Frequency 133MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 256
Operating Supply Voltage 2.5V
Temperature Grade INDUSTRIAL
Interface Parallel
Max Supply Voltage 2.6V
Min Supply Voltage 2.4V
Memory Size 4.5MB
Number of Ports 2
Nominal Supply Current 1.37A
Memory Type RAM, SDR, SRAM
Frequency (Max) 133MHz
Access Time 4.2 ns
Organization 1MX36
Output Characteristics 3-STATE
Address Bus Width 40b
Density 36 Mb
Standby Current-Max 0.08A
I/O Type COMMON
Sync/Async Synchronous
Word Size 36b
Length 17mm
Height Seated (Max) 1.7mm
Width 17mm
Thickness 1.76mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $321.62000 $321.62
12 $316.85167 $3802.22004
27 $309.70481 $8362.02987
70T3509MS133BPGI Product Details

70T3509MS133BPGI Overview


There is a memory type RAM, SDR, SRAM for this type of device. The case comes in the Bulk style. The file is embedded in a BGA case. This chip has an 4.5MB size of memory on it, so a lot of data can be stored on it. The chip contains 256 terminations. As many as 1 functions are supported for comprehensive working. An 2.5V supply is required for this ic memory chip to operate properly. A package of 256 pins is used to protect this memory device. The memory device has 256 pins, which means that it has 256 memory locations, which indicates it is an 256-bit device. This memory runs on an 2.5V operating supply voltage. Memory chips configured with Surface Mount mounting achieve high efficiency and simplicity. The nominal supply current of this memory component is 1.37A. Although it has all the merits this chip has, it is also equipped with FLOW-THROUGH OR PIPELINED ARCHITECTURE to give a performance boost to the system. Each memory address is accessed by one of 2 ports on this chip. An COMMON-bit memory mapped I/O port address is used to address this device. There must be at least an -40°C operating temperature for this device. The part should not be operated at temperatures above 85°C degrees Celsius as otherwise, the part may be damaged due to the excessive amount of heat. This part should have a minimum supply voltage of 2.4V. A maximum voltage of 2.6V shall be allowed for its operating voltage. As a result of the frequency of this memory chip, data can be processed at a rate of 133MHz. This Memory chip operates at a maximum frequency of 133MHz.

70T3509MS133BPGI Features


Package / Case: BGA
256 Pins
Operating Supply Voltage:2.5V
Additional Feature:FLOW-THROUGH OR PIPELINED ARCHITECTURE
I/O Type: COMMON
Freguency at 133MHz
133MHz terminals


70T3509MS133BPGI Applications


There are a lot of Integrated Device Technology (IDT)
70T3509MS133BPGI Memory applications.


  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic

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