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70V261L25PFG8

70V261L25PFG8

70V261L25PFG8

Integrated Device Technology (IDT)

Surface Mount 100 Pin Memory IC 256 kb kb 14mm mm 140mA mA 16b b

SOT-23

70V261L25PFG8 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 7 Weeks
Mount Surface Mount
Package / Case TQFP
Number of Pins 100
Packaging Tape & Reel
Published 2009
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 100
ECCN Code EAR99
Terminal Finish Matte Tin (Sn) - annealed
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
Subcategory SRAMs
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 100
Operating Supply Voltage 3.3V
Temperature Grade COMMERCIAL
Interface Parallel
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Memory Size 32kB
Number of Ports 2
Nominal Supply Current 140mA
Memory Type RAM, SDR, SRAM
Access Time 25 ns
Organization 16KX16
Output Characteristics 3-STATE
Address Bus Width 28b
Density 256 kb
Standby Current-Max 0.003A
I/O Type COMMON
Sync/Async Asynchronous
Word Size 16b
Standby Voltage-Min 3V
Length 14mm
Height Seated (Max) 1.6mm
Width 14mm
Thickness 1.4mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
750 $27.39035 $20542.7625
70V261L25PFG8 Product Details

70V261L25PFG8 Overview


As far as memory types are concerned, RAM, SDR, SRAM is considered to be its memory type. In addition, memory ics is available in a Tape & Reel case as well. In the case of TQFP, it is embedded within the case. A memory chip with a capacity of 32kB is used on this device. On the chip, there are 100 terminations that are planted. The part supports at least 1 functions to ensure a comprehensive working process. In order to function properly, this ic memory chip should be powered by a voltage of 3.3V. The memory device has an 100-pin package, which encloses it in a small package. I have noticed that the memory device has 100 pins, which indicates that it has 100 locations in the memory. According to the datasheet, this memory chip operates at an operating voltage of 3.3V. In this chip, the Surface Mount mounting method is used, a straightforward, high-efficiency mounting method. In terms of its nominal supply current, this memory component has a rating of 140mA. The memory chip also offers INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN to level up system performance despite its merits. The memory chip has 2 ports for granting read/write access to one memory address. There are I/O ports on this memory ics that have COMMON-bit memory mapping. Temperatures below 0°C should not be used with this memory ics. It is recommended that operation of the part be restricted to temperatures not exceeding 70°C, otherwise damage to the part may occur as a result of overheating. In most cases, this memory ics is regarded as being a type of SRAMs. It is recommended that this part be supplied with at least 3V volts. The operating voltage shall not exceed 3.6V.

70V261L25PFG8 Features


Package / Case: TQFP
100 Pins
Operating Supply Voltage:3.3V
Additional Feature:INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN
I/O Type: COMMON


70V261L25PFG8 Applications


There are a lot of Integrated Device Technology (IDT)
70V261L25PFG8 Memory applications.


  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM

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