70V7339S166BFG

new-10%

Manufacturer part number:70V7339S166BFG

Manufacturer:Integrated Device Technology (IDT)

Description:70V7339S166BFG datasheet pdf and Unclassified product details from Integrated Device Technology (IDT) stock available on our website

Case Package:SOT-23

Datasheet:70V7339S166BFG Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	7 Weeks
Mount	Surface Mount
Number of Pins	208
Published	2010
JESD-609 Code	e1
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	208
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature	70°C
Min Operating Temperature	0°C
Additional Feature	PIPELINED ARCHITECTURE OR FLOW-THROUGH
Subcategory	SRAMs
Technology	CMOS
Terminal Position	BOTTOM
Terminal Form	BALL
Peak Reflow Temperature (Cel)	260
Number of Functions	1
Supply Voltage	3.3V
Terminal Pitch	0.8mm
Frequency	166MHz
Time@Peak Reflow Temperature-Max (s)	30
Pin Count	208
Operating Supply Voltage	3.3V
Temperature Grade	COMMERCIAL
Interface	Parallel
Max Supply Voltage	3.45V
Min Supply Voltage	3.15V
Number of Ports	2
Nominal Supply Current	790mA
Memory Type	RAM, SRAM
Access Time	12 ns
Output Characteristics	3-STATE
Address Bus Width	19b
Density	9 Mb
Standby Current-Max	0.03A
Parallel/Serial	SERIAL
I/O Type	COMMON
Sync/Async	Synchronous
Word Size	18b
Length	15mm
Width	15mm
Thickness	1.4mm
Radiation Hardening	No
RoHS Status	RoHS Compliant
Lead Free	Lead Free