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71T75602S133BGG8

71T75602S133BGG8

71T75602S133BGG8

Integrated Device Technology (IDT)

Surface Mount 119 Pin Memory IC 18 Mb kb 14mm mm 195mA mA 36b b

SOT-23

71T75602S133BGG8 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mount Surface Mount
Package / Case BGA
Number of Pins 119
Published 2012
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 119
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature PIPELINED ARCHITECTURE
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 2.5V
Frequency 133MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 119
Operating Supply Voltage 2.5V
Temperature Grade COMMERCIAL
Interface Parallel
Max Supply Voltage 2.625V
Min Supply Voltage 2.375V
Memory Size 2.3MB
Number of Ports 1
Nominal Supply Current 195mA
Memory Type RAM, SDR, SRAM
Frequency (Max) 133MHz
Access Time 4.2 ns
Output Characteristics 3-STATE
Address Bus Width 19b
Density 18 Mb
Standby Current-Max 0.04A
I/O Type COMMON
Sync/Async Synchronous
Word Size 36b
Standby Voltage-Min 2.38V
Length 14mm
Height Seated (Max) 2.36mm
Width 22mm
Thickness 2.15mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
1,000 $21.68775 $21.68775
71T75602S133BGG8 Product Details

71T75602S133BGG8 Overview


As far as memory types are concerned, RAM, SDR, SRAM is considered to be its memory type. In the case of BGA, it is embedded within the case. A memory chip with a capacity of 2.3MB is used on this device. On the chip, there are 119 terminations that are planted. The part supports at least 1 functions to ensure a comprehensive working process. In order to function properly, this ic memory chip should be powered by a voltage of 2.5V. The memory device has an 119-pin package, which encloses it in a small package. I have noticed that the memory device has 119 pins, which indicates that it has 119 locations in the memory. According to the datasheet, this memory chip operates at an operating voltage of 2.5V. In this chip, the Surface Mount mounting method is used, a straightforward, high-efficiency mounting method. In terms of its nominal supply current, this memory component has a rating of 195mA. The memory chip also offers PIPELINED ARCHITECTURE to level up system performance despite its merits. The memory chip has 1 ports for granting read/write access to one memory address. There are I/O ports on this memory ics that have COMMON-bit memory mapping. Temperatures below 0°C should not be used with this memory ics. It is recommended that operation of the part be restricted to temperatures not exceeding 70°C, otherwise damage to the part may occur as a result of overheating. In most cases, this memory ics is regarded as being a type of SRAMs. It is recommended that this part be supplied with at least 2.375V volts. The operating voltage shall not exceed 2.625V. A ic memory chip like this one processes data at a frequency of 133MHz bits per second. A memory chip of this type can operate at a maximum frequency of 133MHz.

71T75602S133BGG8 Features


Package / Case: BGA
119 Pins
Operating Supply Voltage:2.5V
Additional Feature:PIPELINED ARCHITECTURE
I/O Type: COMMON
Freguency at 133MHz
133MHz terminals


71T75602S133BGG8 Applications


There are a lot of Integrated Device Technology (IDT)
71T75602S133BGG8 Memory applications.


  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM

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