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71T75602S133BGGI8

71T75602S133BGGI8

71T75602S133BGGI8

Integrated Device Technology (IDT)

Surface Mount 119 Pin Memory IC 18 Mb kb 14mm mm 215mA mA 36b b

SOT-23

71T75602S133BGGI8 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mount Surface Mount
Package / Case BGA
Number of Pins 119
Published 2012
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 119
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Additional Feature PIPELINED ARCHITECTURE
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 2.5V
Frequency 133MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 119
Operating Supply Voltage 2.5V
Temperature Grade INDUSTRIAL
Interface Parallel
Max Supply Voltage 2.625V
Min Supply Voltage 2.375V
Memory Size 2.3MB
Number of Ports 1
Nominal Supply Current 215mA
Memory Type RAM, SDR, SRAM
Frequency (Max) 133MHz
Access Time 4.2 ns
Output Characteristics 3-STATE
Address Bus Width 19b
Density 18 Mb
Standby Current-Max 0.06A
I/O Type COMMON
Sync/Async Synchronous
Word Size 36b
Standby Voltage-Min 2.38V
Length 14mm
Height Seated (Max) 2.36mm
Width 22mm
Thickness 2.15mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
1,000 $22.64456 $22.64456
71T75602S133BGGI8 Product Details

71T75602S133BGGI8 Overview


In terms of its memory type, it can be classified as RAM, SDR, SRAM. The case is embedded in BGA. Memory size on the chip is 2.3MB. On the chip, there are 119 terminations. The comprehensive working procedure is supported by 1 functions in this part. A voltage of 2.5V is required for the operation of this memory device. An 119-pin package is used to package this memory device. A memory device like this has 119 pins, indicating that there are 119 memory locations on the device. There is a note stating that this memory chip operates at 2.5V. It uses Surface Mount mounting, which is an efficient, straightforward mounting method. As far as its nominal supply current is concerned, this memory component carries a rating of 215mA. It also features PIPELINED ARCHITECTURE to boost system performance despite all its merits. In this chip, there are 1 ports providing read and/or write access to one memory address. A memory mapped I/O port address of COMMON bits is used in this device. A minimum operating temperature of -40°C is required for this device. It should not be operated above 85°C°C. This part should have a minimum supply voltage of at least 2.375V volts in order to function correctly. This part requires a minimum voltage of 2.625V. The frequency of data processing on this memory chip is 133MHz. There is a maximum frequency of 133MHz on this memory chip.

71T75602S133BGGI8 Features


Package / Case: BGA
119 Pins
Operating Supply Voltage:2.5V
Additional Feature:PIPELINED ARCHITECTURE
I/O Type: COMMON
Freguency at 133MHz
133MHz terminals


71T75602S133BGGI8 Applications


There are a lot of Integrated Device Technology (IDT)
71T75602S133BGGI8 Memory applications.


  • eSRAM
  • mainframes
  • multimedia computers
  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer

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