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71V3557S80PFGI

71V3557S80PFGI

71V3557S80PFGI

Integrated Device Technology (IDT)

Surface Mount 100 Pin Memory IC 4.5 Mb kb 20mm mm 260mA mA 36b b

SOT-23

71V3557S80PFGI Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Mount Surface Mount
Package / Case TQFP
Number of Pins 100
Published 2009
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 100
Terminal Finish Matte Tin (Sn) - annealed
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Additional Feature FLOW-THROUGH ARCHITECHTURE
Subcategory SRAMs
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 0.65mm
Frequency 95MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 100
Operating Supply Voltage 3.3V
Temperature Grade INDUSTRIAL
Interface Parallel
Max Supply Voltage 3.465V
Min Supply Voltage 3.135V
Memory Size 512kB
Number of Ports 1
Nominal Supply Current 260mA
Memory Type RAM, SDR, SRAM
Frequency (Max) 100MHz
Access Time 8 ns
Output Characteristics 3-STATE
Address Bus Width 17b
Density 4.5 Mb
Standby Current-Max 0.045A
I/O Type COMMON
Sync/Async Synchronous
Word Size 36b
Length 20mm
Width 14mm
Thickness 1.4mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
144 $6.05285 $871.6104
71V3557S80PFGI Product Details

71V3557S80PFGI Overview


A RAM, SDR, SRAM-type memory can be classified as the memory type of this device. Embedded in the TQFP case, memory ics is a single file. On the chip, there is an 512kB memory, which is the size of the chip's memory. A total of 100 terminations have been planted on the chip. The comprehensive working procedure of this part involves 1 functions. In order to power this memory device, 3.3V will be necessary. A 100-pin package containing this memory device is used to house this device. The memory device in question has 100 pins, thus indicating that it has 100 memory locations that can be accessed. There is a note indicating that this memory chip operates at an 3.3V volt supply voltage. The memory chip utilizes a straightforward, high-efficiency mounting method, Surface Mount mounting. There is a nominal supply current rating of 260mA for this memory component. This chip features all the merits of a conventional chip, but it also features FLOW-THROUGH ARCHITECHTURE to improve system performance. 1 ports allow read/write access to one memory address in this chip. As part of the design, the I/O port addresses are mapped into the memory using an COMMON-bit number. There must not be a minimum operating temperature of less than -40°C for this device. A temperature of no more than 85°C centigrade is recommended for the component to be operated, otherwise, damage might be inflicted on the component. Usually, this memory ics falls under the SRAMs component category. Ideally, this part should be supplied with a voltage of at least 3.135V. An operating voltage of no more than 3.465V is required. A frequency of 95MHz is used to process the data on this memory chip. A ic memory chip with this frequency has a maximum speed of 100MHz.

71V3557S80PFGI Features


Package / Case: TQFP
100 Pins
Operating Supply Voltage:3.3V
Additional Feature:FLOW-THROUGH ARCHITECHTURE
I/O Type: COMMON
Freguency at 95MHz
95MHz terminals


71V3557S80PFGI Applications


There are a lot of Integrated Device Technology (IDT)
71V3557S80PFGI Memory applications.


  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM
  • graphics card

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