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71V3577S80BGG

71V3577S80BGG

71V3577S80BGG

Integrated Device Technology (IDT)

Surface Mount 119 Pin Memory IC 4.5 Mb kb 14mm mm 200mA mA 36b b

SOT-23

71V3577S80BGG Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 7 Weeks
Mount Surface Mount
Package / Case BGA
Number of Pins 119
Published 2005
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 119
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature FLOW THROUGH ARCHITECTURE
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 119
Operating Supply Voltage 3.3V
Temperature Grade COMMERCIAL
Interface Parallel
Max Supply Voltage 3.465V
Min Supply Voltage 3.135V
Memory Size 512kB
Number of Ports 1
Nominal Supply Current 200mA
Memory Type RAM, SDR, SRAM
Frequency (Max) 100MHz
Access Time 8 ns
Output Characteristics 3-STATE
Address Bus Width 17b
Density 4.5 Mb
Standby Current-Max 0.03A
I/O Type COMMON
Sync/Async Synchronous
Word Size 36b
Length 14mm
Height Seated (Max) 2.36mm
Width 22mm
Thickness 2.15mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
168 $5.57500 $936.6
71V3577S80BGG Product Details

71V3577S80BGG Overview


A RAM, SDR, SRAM-type memory can be classified as the memory type of this device. Embedded in the BGA case, memory ics is a single file. On the chip, there is an 512kB memory, which is the size of the chip's memory. A total of 119 terminations have been planted on the chip. The comprehensive working procedure of this part involves 1 functions. In order to power this memory device, 3.3V will be necessary. A 119-pin package containing this memory device is used to house this device. The memory device in question has 119 pins, thus indicating that it has 119 memory locations that can be accessed. There is a note indicating that this memory chip operates at an 3.3V volt supply voltage. The memory chip utilizes a straightforward, high-efficiency mounting method, Surface Mount mounting. There is a nominal supply current rating of 200mA for this memory component. This chip features all the merits of a conventional chip, but it also features FLOW THROUGH ARCHITECTURE to improve system performance. 1 ports allow read/write access to one memory address in this chip. As part of the design, the I/O port addresses are mapped into the memory using an COMMON-bit number. There must not be a minimum operating temperature of less than 0°C for this device. A temperature of no more than 70°C centigrade is recommended for the component to be operated, otherwise, damage might be inflicted on the component. Usually, this memory ics falls under the SRAMs component category. Ideally, this part should be supplied with a voltage of at least 3.135V. An operating voltage of no more than 3.465V is required. A frequency of 100MHz is used to process the data on this memory chip. A ic memory chip with this frequency has a maximum speed of 100MHz.

71V3577S80BGG Features


Package / Case: BGA
119 Pins
Operating Supply Voltage:3.3V
Additional Feature:FLOW THROUGH ARCHITECTURE
I/O Type: COMMON
Freguency at 100MHz
100MHz terminals


71V3577S80BGG Applications


There are a lot of Integrated Device Technology (IDT)
71V3577S80BGG Memory applications.


  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM
  • graphics card

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