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71V65803S133BGG8

71V65803S133BGG8

71V65803S133BGG8

Integrated Device Technology (IDT)

Surface Mount 119 Pin Memory IC 9 Mb kb 14mm mm 300mA mA 18b b

SOT-23

71V65803S133BGG8 Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 7 Weeks
Mount Surface Mount
Package / Case BGA
Number of Pins 119
Packaging Tape & Reel
Published 2005
JESD-609 Code e1
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 119
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature PIPELINED ARCHITECTURE
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Frequency 133MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 119
Operating Supply Voltage 3.3V
Temperature Grade COMMERCIAL
Interface Parallel
Max Supply Voltage 3.465V
Min Supply Voltage 3.135V
Number of Ports 1
Nominal Supply Current 300mA
Memory Type RAM, SRAM
Access Time 4.2 ns
Output Characteristics 3-STATE
Address Bus Width 19b
Density 9 Mb
Standby Current-Max 0.04A
I/O Type COMMON
Sync/Async Synchronous
Word Size 18b
Length 14mm
Height Seated (Max) 2.36mm
Width 22mm
Thickness 2.15mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
71V65803S133BGG8 Product Details

71V65803S133BGG8 Overview


A RAM, SRAM-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tape & Reel case as well. Embedded in the BGA case, memory ics is a single file. A total of 119 terminations have been planted on the chip. The comprehensive working procedure of this part involves 1 functions. In order to power this memory device, 3.3V will be necessary. A 119-pin package containing this memory device is used to house this device. The memory device in question has 119 pins, thus indicating that it has 119 memory locations that can be accessed. There is a note indicating that this memory chip operates at an 3.3V volt supply voltage. The memory chip utilizes a straightforward, high-efficiency mounting method, Surface Mount mounting. There is a nominal supply current rating of 300mA for this memory component. This chip features all the merits of a conventional chip, but it also features PIPELINED ARCHITECTURE to improve system performance. 1 ports allow read/write access to one memory address in this chip. As part of the design, the I/O port addresses are mapped into the memory using an COMMON-bit number. There must not be a minimum operating temperature of less than 0°C for this device. A temperature of no more than 70°C centigrade is recommended for the component to be operated, otherwise, damage might be inflicted on the component. Usually, this memory ics falls under the SRAMs component category. Ideally, this part should be supplied with a voltage of at least 3.135V. An operating voltage of no more than 3.465V is required. A frequency of 133MHz is used to process the data on this memory chip.

71V65803S133BGG8 Features


Package / Case: BGA
119 Pins
Operating Supply Voltage:3.3V
Additional Feature:PIPELINED ARCHITECTURE
I/O Type: COMMON
Freguency at 133MHz
133MHz terminals


71V65803S133BGG8 Applications


There are a lot of Integrated Device Technology (IDT)
71V65803S133BGG8 Memory applications.


  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM
  • graphics card

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