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71V67602S166PFG8

71V67602S166PFG8

71V67602S166PFG8

Integrated Device Technology (IDT)

71V67602S166PFG8 datasheet pdf and Unclassified product details from Integrated Device Technology (IDT) stock available on our website

SOT-23

71V67602S166PFG8 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mount Surface Mount
Package / Case TQFP
Number of Pins 100
Published 2004
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 100
Terminal Finish Matte Tin (Sn) - annealed
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Additional Feature PIPELINED ARCHITECTURE
Subcategory SRAMs
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 0.65mm
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 100
Operating Supply Voltage 3.3V
Temperature Grade COMMERCIAL
Interface Parallel
Max Supply Voltage 3.465V
Min Supply Voltage 3.135V
Memory Size 1.1MB
Number of Ports 1
Nominal Supply Current 340mA
Memory Type RAM, SDR, SRAM
Frequency (Max) 166MHz
Access Time 3.5 ns
Organization 256KX36
Output Characteristics 3-STATE
Address Bus Width 18b
Density 9 Mb
Standby Current-Max 0.05A
I/O Type COMMON
Sync/Async Synchronous
Word Size 36b
Length 20mm
Width 14mm
Thickness 1.4mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
1,000 $14.01908 $14.01908

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