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ICS542MILF

ICS542MILF

ICS542MILF

Integrated Device Technology (IDT)

3.3V Clock Buffer DUAL 8 Pins SOIC

SOT-23

ICS542MILF Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Package / Case SOIC
Number of Pins 8
Published 1999
JESD-609 Code e3
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
Terminal Finish Matte Tin (Sn) - annealed
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 8
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Max Supply Voltage 5V
Min Supply Voltage 3V
Family 542
Logic Function Clock
Output Characteristics 3-STATE
Propagation Delay (tpd) 15 ns
Same Edge Skew-Max (tskwd) 0.5 ns
Number of True Outputs 2
Max Frequency@Nom-Sup 156000000Hz
Input Conditioning STANDARD
Height 1.5mm
Length 5mm
Width 4mm
RoHS Status RoHS Compliant
ICS542MILF Product Details

ICS542MILF Overview


It is available in the case SOIC for this cut smart buffer. There are 8 terminations in it. Using a supply voltage of 3.3V allows for high efficiency. It's in the way of Surface Mount. It has a number of pins of 8. The 8 pins are utilized for operation. At a minimum working temperature of -40°C, it maintains reliable operation. When the maximum operating temperature is set to 85°C, stable operation is ensured. It is part of the 542 family of electronic buffer ICs. It is possible to get 2 true outputs. There is a maximum supply voltage of 5VV that can be handled by this clock divider. As low as possible, the voltage source of the clock divider can be 3V.

ICS542MILF Features


8 terminations


ICS542MILF Applications


There are a lot of Integrated Device Technology (IDT)
ICS542MILF Clock Buffers & Drivers applications.


  • High performance communication system
  • Data center
  • Cloud computing
  • Network
  • High speed industry
  • High-end consumer electronics
  • Data communication
  • Telecommunications
  • Computing
  • Medical imaging

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