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ICS83023AMILF

ICS83023AMILF

ICS83023AMILF

Integrated Device Technology (IDT)

3.3V Clock Buffer DUAL 8 Pins SOIC

SOT-23

ICS83023AMILF Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Package / Case SOIC
Number of Pins 8
JESD-609 Code e3
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Terminal Finish Matte Tin (Sn) - annealed
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 2
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 8
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Logic Function Clock
Prop. Delay@Nom-Sup 2.4 ns
Propagation Delay (tpd) 2.4 ns
Same Edge Skew-Max (tskwd) 0.06 ns
Number of True Outputs 1
Input Conditioning DIFFERENTIAL
Height 1.5mm
Length 5mm
Width 4mm
RoHS Status RoHS Compliant
ICS83023AMILF Product Details

ICS83023AMILF Overview


SOIC case is available for the cut smart buffer. A total of 8 terminations have been found in it. The supply voltage of 3.3V is capable of providing high efficiency. There is a place for it in the way of Surface Mount. On this board, there is a pin count of 8. In order for the timeing clock to operate, it is connected to the 8 pins. It is designed to operate at a minimum temperature of -40°C in order to maintain reliability. In order to ensure stable operation, the maximum operating temperature must be set to 85°C. It is possible to have 1 true outputs. It is capable of handling a maximum supply voltage of 3.6V volts. As low as possible is the source voltage 3V, which can be used by the system to work.

ICS83023AMILF Features


8 terminations


ICS83023AMILF Applications


There are a lot of Integrated Device Technology (IDT)
ICS83023AMILF Clock Buffers & Drivers applications.


  • Clock signal level shifting
  • High performance communication system
  • Data center
  • Cloud computing
  • Network
  • High speed industry
  • High-end consumer electronics
  • Data communication
  • Telecommunications
  • Computing

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