ICS853S011BGILFT Overview

A TSSOP case is used for packaging. A Tape & Reel (TR) is used to package it. Under normal circumstances, 2.5GHz is the maximum value. In the direction of Surface Mount, it is placed. A minimum temperature of -40°C is required for reliability. By operating at 85°C degrees Celsius, stable operation is enabled.

ICS853S011BGILFT Features

ICS853S011BGILFT Applications

There are a lot of Integrated Device Technology (IDT)
ICS853S011BGILFT Clock Buffers & Drivers applications.

• Medical instruments
• Furniture
• Machine made
• Clock signal duplication
• Clock signal format conversion
• Clock signal level shifting
• High performance communication system
• Data center
• Cloud computing
• Network