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ICS889872AKLF

ICS889872AKLF

ICS889872AKLF

Integrated Device Technology (IDT)

1 Circuit 2GHz 2.5V Clock Buffer QUAD 16 Pins

SOT-23

ICS889872AKLF Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Number of Pins 16
JESD-609 Code e3
Pbfree Code yes
Number of Terminations 16
Terminal Finish Matte Tin (Sn)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Terminal Position QUAD
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 2.5V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 16
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 2.625V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.375V
Number of Circuits 1
Frequency (Max) 2GHz
Family 889872
Input CML
Logic IC Type LOW SKEW CLOCK DRIVER
Propagation Delay (tpd) 0.75 ns
fmax-Min 2000 MHz
Number of True Outputs 3
Length 3mm
Width 3mm
RoHS Status RoHS Compliant
ICS889872AKLF Product Details

ICS889872AKLF Overview


There is a maximum value of 2GHz for normal operation. There are 16 terminations in it. Using a supply voltage of 2.5V allows for high efficiency. It's in the way of Surface Mount. It has a number of pins of 16. The 16 pins are utilized for operation. At a minimum working temperature of -40°C, it maintains reliable operation. When the maximum operating temperature is set to 85°C, stable operation is ensured. It is part of the 889872 family of electronic buffer ICs. It's set to 2.625V for the maximum supply voltage (Vsup). A logic IC with a value of LOW SKEW CLOCK DRIVER is used for this application. To ensure normal operation of the cut smart buffer, the supply voltage (Vsup) should always be kept above 2.375V. It is possible to get 3 true outputs.

ICS889872AKLF Features


16 terminations
logic IC type of LOW SKEW CLOCK DRIVER


ICS889872AKLF Applications


There are a lot of Integrated Device Technology (IDT)
ICS889872AKLF Clock Buffers & Drivers applications.


  • High performance communication system
  • Data center
  • Cloud computing
  • Network
  • High speed industry
  • High-end consumer electronics
  • Data communication
  • Telecommunications
  • Computing
  • Medical imaging

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