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IDT2309NZ-1HPGGI

IDT2309NZ-1HPGGI

IDT2309NZ-1HPGGI

Integrated Device Technology (IDT)

3.3V Clock Buffer DUAL 16 Pins TSSOP

SOT-23

IDT2309NZ-1HPGGI Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Package / Case TSSOP
Number of Pins 16
Published 2009
JESD-609 Code e3
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 16
ECCN Code EAR99
Terminal Finish Matte Tin (Sn) - annealed
Max Operating Temperature 85°C
Min Operating Temperature -40°C
HTS Code 8542.39.00.01
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 16
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Family 2309
Logic Function Clock
Max I(ol) 0.008 A
Prop. Delay@Nom-Sup 8.7 ns
Propagation Delay (tpd) 8.7 ns
fmax-Min 133.33 MHz
Same Edge Skew-Max (tskwd) 0.25 ns
Number of True Outputs 9
Input Conditioning STANDARD
Height 1mm
Length 5mm
Width 4.4mm
RoHS Status RoHS Compliant
IDT2309NZ-1HPGGI Product Details

IDT2309NZ-1HPGGI Overview


There is a case option of TSSOP available for this clock divider. 16 terminations have been recorded. With a supply voltage of 3.3V, high efficiency is possible. Surface Mount is placed within the way of this object. A pin count of 16 can be found on it. It is operated using the 16 pins. In order to maintain reliability, the maximum operating temperature is -40°C. The maximum operating temperature of 85°C enables stable operation. The gadget belongs to the 2309 family of clock buffers. We are able to produce 9 true outputs. There is a maximum supply voltage of 3.6VV that can be handled by the clock divider. As low as possible, it can be worked with a source voltage of 3V, or as close to that as possible.

IDT2309NZ-1HPGGI Features


16 terminations


IDT2309NZ-1HPGGI Applications


There are a lot of Integrated Device Technology (IDT)
IDT2309NZ-1HPGGI Clock Buffers & Drivers applications.


  • Clock signal duplication
  • Clock signal format conversion
  • Clock signal level shifting
  • High performance communication system
  • Data center
  • Cloud computing
  • Network
  • High speed industry
  • High-end consumer electronics
  • Data communication

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