3.3V V -- 119 Pin Memory IC -- Series IDT71V3559 22mm mm
SOT-23
IDT71V3559SA75BG8 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
BGA
Surface Mount
YES
Mounting Type
Surface Mount
Supplier Device Package
119-PBGA (14x22)
Packaging
Tape & Reel (TR)
Published
2009
Operating Temperature
0°C ~ 70°C (TA)
Series
--
JESD-609 Code
e0
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
119
ECCN Code
3A991.B.2.A
Terminal Finish
Tin/Lead (Sn63Pb37)
Max Operating Temperature
70°C
Min Operating Temperature
0°C
Additional Feature
FLOW-THROUGH ARCHITECTURE
HTS Code
8542.32.00.41
Voltage - Supply
3.135 V ~ 3.465 V
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Number of Functions
1
Supply Voltage
3.3V
Terminal Pitch
1.27mm
Reach Compliance Code
not_compliant
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
IDT71V3559
Pin Count
119
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
3.465V
Power Supplies
3.3V
Temperature Grade
COMMERCIAL
Supply Voltage-Min (Vsup)
3.135V
Interface
Parallel
Memory Size
4.5Mb (256K x 18)
Memory Type
RAM, SRAM
Operating Mode
SYNCHRONOUS
Clock Frequency
100MHz
Supply Current-Max
0.275mA
Access Time
7.5ns
Memory Format
SRAM
Memory Interface
Parallel
Organization
256KX18
Output Characteristics
3-STATE
Memory Width
18
Write Cycle Time - Word, Page
--
Standby Current-Max
0.04A
Memory Density
4718592 bit
Access Time (Max)
7.5 ns
I/O Type
COMMON
Standby Voltage-Min
3.14V
Length
22mm
Height Seated (Max)
2.36mm
Width
14mm
RoHS Status
Non-RoHS Compliant
IDT71V3559SA75BG8 Product Details
IDT71V3559SA75BG8 Overview
RAM, SRAM is its memory type. It is available in a case with a Tape & Reel (TR) shape. As you can see, it is embedded in BGA case. There is an 4.5Mb (256K x 18) memory capacity on the chip. In this device, the memory is of the SRAM-format, which is a popular format in the mainstream computing sector. Due to its extended operating temperature range, the device is well suited for a wide range of demanding applications. A voltage of 3.135 V ~ 3.465 V is possible to be applied to the supply. There is a recommendation that Surface Mount mounting type should be used for this product. As you can see from the diagram, the chip is planted with 119 terminations. In total, 1 functions are supported by this part. The memory device designed for this application has been designed to be powered by an 3.3V power supply. With a clock frequency of 100MHz, the memory rotates on its own. To select similar parts, many people use the device's base part number IDT71V3559. It has 119 pins indicating it has 119 memory locations. While this memory chip features many merits, it also offers FLOW-THROUGH ARCHITECTURE for improving system performance. This memory chip requires a mere 3.3V of power. In addition to this device, there are COMMON-bit memory mapped I/O port addresses on this device. Among the -- series of memory devices, this part is essential for its applications. A minimum operating temperature of 0°C must be met by this device. As a general rule, memory ics is recommended that the product be operated at temperatures no higher than 70°Cc, otherwise, damage could be done to it. This memory ics is capable of operating with an input current of 0.275mA at max.
IDT71V3559SA75BG8 Features
Package / Case: BGA Additional Feature:FLOW-THROUGH ARCHITECTURE I/O Type: COMMON
IDT71V3559SA75BG8 Applications
There are a lot of Integrated Device Technology (IDT) IDT71V3559SA75BG8 Memory applications.