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IDT71V67602S133BGI8

IDT71V67602S133BGI8

IDT71V67602S133BGI8

Integrated Device Technology (IDT)

2.53.3V V 119 Pin Memory IC 22mm mm

SOT-23

IDT71V67602S133BGI8 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Package / Case BGA
Surface Mount YES
Packaging Tape & Reel (TR)
Published 2009
JESD-609 Code e0
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 119
ECCN Code 3A991.B.2.A
Terminal Finish Tin/Lead (Sn63Pb37)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Additional Feature PIPELINED ARCHITECTURE
HTS Code 8542.32.00.41
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Reach Compliance Code not_compliant
Frequency 133MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 119
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.465V
Power Supplies 2.53.3V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 3.135V
Interface Parallel
Memory Type RAM, SRAM
Operating Mode SYNCHRONOUS
Supply Current-Max 0.28mA
Organization 256KX36
Output Characteristics 3-STATE
Memory Width 36
Standby Current-Max 0.07A
Memory Density 9437184 bit
Access Time (Max) 4.2 ns
I/O Type COMMON
Standby Voltage-Min 3.14V
Length 22mm
Height Seated (Max) 2.36mm
Width 14mm
RoHS Status Non-RoHS Compliant
IDT71V67602S133BGI8 Product Details

IDT71V67602S133BGI8 Overview


RAM, SRAM is its memory type. It is available in a case with a Tape & Reel (TR) shape. As you can see, it is embedded in BGA case. As you can see from the diagram, the chip is planted with 119 terminations. In total, 1 functions are supported by this part. The memory device designed for this application has been designed to be powered by an 3.3V power supply. It has 119 pins indicating it has 119 memory locations. While this memory chip features many merits, it also offers PIPELINED ARCHITECTURE for improving system performance. This memory chip requires a mere 2.53.3V of power. In addition to this device, there are COMMON-bit memory mapped I/O port addresses on this device. A minimum operating temperature of -40°C must be met by this device. As a general rule, memory ics is recommended that the product be operated at temperatures no higher than 85°Cc, otherwise, damage could be done to it. This memory ics is capable of operating with an input current of 0.28mA at max. In this memory chip, data is processed at a frequency of 133MHz.

IDT71V67602S133BGI8 Features


Package / Case: BGA
Additional Feature:PIPELINED ARCHITECTURE
I/O Type: COMMON
Freguency at 133MHz
133MHz terminals


IDT71V67602S133BGI8 Applications


There are a lot of Integrated Device Technology (IDT)
IDT71V67602S133BGI8 Memory applications.


  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM
  • graphics card
  • hard disk drive (HDD)

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