IDTSTAC9202X3TAEA1XR Overview

Due to space constraints, it is supplied in the LQFP package. This package uses the Tape & Reel (TR) packaging method. Based on the Surface Mount technology, the module is mounted to a PCB. 70°C is set as the maximum operating temperature to keep the system working normally. Normal operation is maintained by setting the operating temperature low at 0°C.

IDTSTAC9202X3TAEA1XR Features

Embedded in the LQFP package

IDTSTAC9202X3TAEA1XR Applications

There are a lot of Integrated Device Technology (IDT)
IDTSTAC9202X3TAEA1XR CODECs Interface ICs applications.

• Filling
• Food & beverage
• Linear measurement
• Material handling
• Metal forming & fabrication
• Mobile equipement
• Motor feedback
• Packaging
• Printing
• Registration mark timing